http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100450091-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85464 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 1999-10-01^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2004-09-30^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2004-09-30^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100450091-B1 |
| titleOfInvention | Multiplated lead frame for semiconductor device |
| abstract | The present invention relates to a multilayer lead frame. According to the present invention, a substrate material of copper material, a nickel layer formed on the upper layer of the substrate material, a palladium layer formed on the upper layer of the nickel layer, and formed on top of the palladium layer, finely on the surface of the palladium layer There is provided a multilayer lead frame with dispersed gold or gold alloy portions. The lead frame having a multi-layer plating structure according to the present invention can ideally coexist the advantages of the gold or gold alloy plating layer and the advantages of the palladium plating layer, thus wire bonding and solderability, which are ultimate quality goals of the lead frame. And, there is an advantage that the EMC adhesion is improved. In addition, manufacturing costs can be reduced. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101092616-B1 |
| priorityDate | 1999-10-01^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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