| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76888
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 |
| filingDate |
1998-09-17^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-05-03^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2006-05-03^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100555931-B1 |
| titleOfInvention |
How to form a buried copper wiring and a buried copper wiring structure |
| abstract |
A method of forming a buried copper wiring includes forming an insulating layer, forming a buried copper wiring in the insulating layer, planarizing an exposed surface of the insulating layer including an exposed surface of the buried copper wiring, and embedding copper wiring Forming a silver protective thin film on the exposed surface of the film. By repeating these steps on an already existing insulating layer, multiple layers of embedded copper wiring are created. The exposed surface of the buried copper wiring is plated with silver by substitution plating. |
| priorityDate |
1997-09-18^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |