http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100563184-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0758 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 1998-01-26^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-05-25^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2006-05-25^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100563184-B1 |
| titleOfInvention | Positive Photoresist Composition |
| abstract | (A) 100 parts by weight of alkali-soluble Novolak resin and based on thisn n n (B) 10 to 80% by weight of a radically polymerizable compound unit having an alcohol hydroxyl group as a structural unit, and at least one unit of a radically polymerizable compound unit having a carboxyl group and a radically polymerizable compound unit having a phenol hydroxyl group 3 5 to 50 parts by weight of an alkali-soluble acrylic resin containing from 50 to 50% by weight,n n n (C) 5 to 100 parts by weight of a quinonediazide group-containing compound andn n n (D) solventn n n It provides a positive photoresist composition comprising a. This composition has good adhesion to the substrate and good plating solution resistance upon development, and can also be wetted well with the plating liquid. The composition can be well stripped from the substrate in the resist unexposed areas and is suitable for the formation of a thick film suitable as a bump forming material. |
| priorityDate | 1997-01-27^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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