http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100601490-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C02F1-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C02F1-461 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-16 |
| filingDate | 2004-09-23^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-07-18^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2006-07-18^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100601490-B1 |
| titleOfInvention | Regeneration Treatment Method for Stacked Via Hole Filled Copper Plating Solution |
| abstract | The present invention relates to a method for regenerating a stacked via-hole filled copper plating solution, which is an unnecessary aging component in a stacked via-hole filled copper plating liquid through photoreaction using a K 4 Nb 6 O 17 photocatalyst having a selective removal performance against a brightener and ultraviolet light. It is characterized by treating with high selectivity.n n n According to the method of the present invention, it is possible to remove and selectively remove a gloss including a modified varnish, and exhibit a high gloss removal efficiency even under high dynamic concentrations, thereby controlling the filling performance of the stack type via hole according to the gloss modification. You can expect In addition, there is an advantage that the cost of bathing is reduced by extending the bathing cycle by optimizing the state of the entire copper plating solution.n n n n Stack, Via Hole, Fill Copper Plating Solution, Regeneration, Photocatalyst, Ultraviolet |
| priorityDate | 2004-09-23^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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