http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100651320-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73215 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4824 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B41-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V23-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V23-026 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2005-03-07^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-11-29^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2006-11-29^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100651320-B1 |
| titleOfInvention | Board-on-Chip Ball Grid Array Substrate and Manufacturing Method Thereof |
| abstract | The present invention removes the plating lead wire of the wire bonding pad and the solder ball pad, and then forms a window for wire bonding, thereby generating a metal burr in the window. The present invention relates to a board on chip ball grid array (BOC-BGA) substrate and a method of manufacturing the same, which prevents product defects caused by metal burrs.n n n n BOC, BGA, BOC-BGA, Board-on-Chip, Plating Leads, Printed Circuit Boards |
| priorityDate | 2005-03-07^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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