abstract |
The present invention relates to a bonding tool for bonding fine wire to a bonding pad having a significant fine pitch. The bonding tool includes a working tip at its end. The working tip includes an annular chamfer formed inside the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is connected to the bottom of the cylindrical passageway formed in the bonding tool. |