| abstract |
Provided is a light emitting diode package that has excellent heat dissipation and is easy to manufacture. The light emitting diode package of the present invention includes an aluminum substrate having a reflective cup formed thereon and at least one light emitting diode chip mounted on a bottom surface of the reflective cup. The bottom surface of the reflective cup is separated into a plurality of substrate electrodes by an aluminum anodization film penetrating the aluminum substrate. At least one substrate electrode is surrounded by the aluminum anodization layer, and the plurality of substrate electrodes are electrically connected to the light emitting diode chip, respectively.n n n n Light Emitting Diode, LED, Anodized Film, Heat Dissipation |