http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100760408-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N15-06 |
| filingDate | 2000-08-30^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-09-19^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2007-09-19^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100760408-B1 |
| titleOfInvention | How to measure leveler concentration in plating solution |
| abstract | In the present invention, the leveler concentration in the plating liquid of the plating apparatus used to fill metals such as copper in the wiring grooves and holes formed on the surface of the semiconductor substrate or the like is measured in the peeling region of the plating liquid measured by the CV method or the CVS method. It is characterized by calculating | requiring based on the peak value area (Ar value) of.n n n n Leveler, Concentration, CVS Method, Plating Solution, Concentration Management |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102239458-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101901781-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150129943-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210083019-A |
| priorityDate | 1999-08-30^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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