http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100827312-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-013 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate | 2006-10-02^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-05-06^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-05-06^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100827312-B1 |
| titleOfInvention | Method of forming coverlay of printed circuit board |
| abstract | Disclosed is a method of forming a coverlay of a printed circuit board. (a) providing a substrate having a circuit pattern formed thereon; (b) selectively applying a protective ink to the substrate by an inkjet method; (c) The method of forming a coverlay of a printed circuit board comprising supplying heat or ultraviolet rays to the protective ink to cure the protective ink is complicated by applying a polymer ink with an inkjet to form a coverlay of a flexible circuit board. Shaped coverlays can be easily implemented and provide high precision and improved yields.n n n n Printed Circuit Boards, Coverlays, Inkjets |
| priorityDate | 2006-10-02^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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