| abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive adhesive composition which can be used as a connection material between modules when mounting various display devices including a liquid crystal display device (LCD) and a semiconductor device, and more particularly, an adhesive film using the same. It is characterized in that it comprises a resin as a component of the binder portion, according to the present invention, it exhibits high adhesion even under heat shrinkage accompanying curing, and excellent in heat resistance, moisture resistance, and mechanical properties to maintain adhesion reliability, especially under high temperature and high humidity conditions. There are advantages to it. In addition, it is possible to ensure the stability of the crude liquid during manufacture, and there is an advantage in the manufacturing process by securing sufficient film strength after coating. |