http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100846569-B1

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-07
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02
filingDate 2006-06-14^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2008-07-15^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2008-07-15^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100846569-B1
titleOfInvention Package of MEMS element and manufacturing method thereof
abstract The present invention is to provide a package of a MEMS (Micro-Electro Mechanical Systems) device applying a wafer level package (WLP) that can be applied to a batch process of a semiconductor production plant, and a method of manufacturing the same. According to an aspect of the present invention, a plurality of first external portions are provided on a cap wafer, a plurality of bonding bumps formed on the cap wafer, a plurality of alignment bumps formed in alignment with an outer portion of the plurality of bonding bumps, and a portion corresponding to the plurality of alignment bumps. A pad is formed to provide a package of a MEMS device including a wafer for MEMS devices in which the alignment bump and the first external pad are bonded to each other when the cap wafer is bonded to the cap wafer.n n n n Wafer Level Package (WLP), Micro-Electro Mechanical Systems (MEMS)
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101708531-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150021871-A
priorityDate 2006-06-14^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
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http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541

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