| abstract |
The present invention provides a cleaning composition that is less corrosive to wiring materials and has excellent cleaning properties of semiconductor substrates or semiconductor devices with microparticles and metal impurities. A cleaning composition comprising a reducing agent, having a redox potential (25 ° C.) of +0.2 V or less, and a pH (25 ° C.) of 3 to 12, and a method for cleaning a semiconductor substrate or semiconductor element using the cleaning composition. .n n n Redox potential, semiconductor substrates, semiconductor devices |