http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100894609-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-1433 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2007-01-23^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-04-24^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-04-24^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100894609-B1 |
| titleOfInvention | Photosensitive thermosetting resin composition, a planarized resist film coated printed wiring board and a method of manufacturing the same |
| abstract | INDUSTRIAL APPLICABILITY The present invention can provide a solder resist film for an LED printed circuit board, has excellent resistance to HAST resistance and gold plating, has excellent light reflectance factor as well as glossiness, and thus can emit light of a diode more effectively The present invention provides a photosensitive thermosetting resin composition. Such a photosensitive thermosetting resin compositionn n n [I] an alkoxy group-containing silane-modified epoxy resin obtained by subjecting a hydrolyzable alkoxysilane to a deblocking reaction with an epoxy resin represented by the following formula (I / E);n n n (I / E)n n n [II] an unsaturated group-containing polycarboxylic acid resin having an ethylenic unsaturated group and two or more carboxyl groups in the molecule and having an acid value (mg KOH / g) of the solid content of 50 to 150;n n n [III] diluent;n n n [IV] a photopolymerization initiator; Andn n n [V] curing adhesion property-imparting agent,n n n Wherein the content ratio of the component [I] to the component [II] is 2/100 to 50/100, and the photosensitive thermosetting resin composition is used in an amount of 5 to 500 wt% based on 100 wt% 0.1 to 30 parts by weight of component [IV] and 0.1 to 20 parts by weight of component [V].n n n n A photosensitive thermosetting resin composition, a resist film, a printed wiring board, |
| priorityDate | 2006-03-17^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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