| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P2015-0842
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P1-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-0802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-18 |
| filingDate |
2006-11-24^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-10-05^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2010-10-05^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100985453-B1 |
| titleOfInvention |
Sensor device and manufacturing method thereof |
| abstract |
Provided is a compact sensor device having stable sensor characteristics and a method of manufacturing the same. The sensor device is formed including a sensor substrate and a pair of package substrates bonded to both surfaces of the sensor substrate. The sensor substrate includes a frame having an opening, a movable portion held in the opening so as to be movable relative to the frame, and a detector for outputting an electrical signal in accordance with the positional displacement of the movable portion. The surface activation region is formed in the frame of the sensor substrate and the package substrate by using an inert gas plasma, an ion beam or an atomic beam. By directly bonding the surface active region of the sensor substrate and the package substrate at room temperature, the problem caused by the residual stress of the bonded portion can be avoided. |
| priorityDate |
2005-11-25^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |