http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101020004-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y40-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B9-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P11-003 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B82Y40-00 |
| filingDate | 2009-02-19^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-03-09^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-03-09^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101020004-B1 |
| titleOfInvention | Planar straight strip transmission line and manufacturing method thereof |
| abstract | The present invention relates to a planar straight strip transmission line and a method of manufacturing the same, wherein the planar straight strip transmission line of the present invention comprises: a first insulating layer; Strip transmission line layer; A second insulating layer; And the functional pattern layer to adjust the impedance, etc., to minimize the loss of crosstalk and transmission signal, and the inconvenience of installation, which is a disadvantage of the existing round cable wire, the appearance problem by the external exposure of the round wire, the unit weight increase and Problems such as carbon dioxide generated during manufacturing can be solved. In addition, the planar straight strip transmission line of the present invention further includes a tape layer, cut into a desired size, and can be installed at a desired position, thereby providing excellent workability.n n n The planar straight strip transmission line manufacturing method of the present invention converts using an insulating or dielectric film including a release adhesive layer, and after conversion, removes the insulating or dielectric film including the release adhesive layer, and then removes the insulating or dielectric film. The bonding process facilitates the conversion and increases the bonding force between the transmission line layers.n n n n Planar straight strip transmission line, functional pattern layer, impedance, tape layer |
| priorityDate | 2009-02-19^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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