http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101114358-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04 |
| filingDate | 2009-04-20^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-03-14^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-03-14^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101114358-B1 |
| titleOfInvention | Adhesive film and backlining method using the same |
| abstract | The present invention relates to an adhesive film and a method for backgrinding a semiconductor wafer using the same. In the present invention, for example, there is provided an adhesive film which is excellent in cutting properties and adhesion in a semiconductor manufacturing process and has excellent cushioning properties and can significantly improve production efficiency in a semiconductor manufacturing process of wafer backgrinding. In addition, the present invention can provide an adhesive film excellent in peeling properties, re-peelability, and wettability to a wafer and a backgrinding method using the same while exhibiting excellent water resistance.n n n n Adhesive film, protective film, backgrinding, toughness, elongation |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014010933-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101539133-B1 |
| priorityDate | 2008-04-21^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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