http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101211447-B1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-40
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filingDate 2011-03-24^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2012-12-12^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2012-12-12^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101211447-B1
titleOfInvention Method of manufacturing printed wiring boards and printed wiring boards
abstract The printed wiring board includes a core substrate having a through hole, a first circuit on a first surface of the substrate, a second circuit on a second surface of the substrate, and a through hole conductor in a hole connecting the first and second circuits. do. The hole has first and second openings. The first opening is taper to face towards the second surface. The second opening is taper towards the first surface. The first opening has first and second portions. The second opening has first and second portions. The first and second portions of the first opening form inner walls that curve inward at the boundary between the first and second portions. The first and second portions of the second opening form inner walls that curve inward at the boundary between the first and second portions.
priorityDate 2010-03-25^^<http://www.w3.org/2001/XMLSchema#date>
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