| abstract |
The resin composition for flip chip mounting suitable for flip chip mounting with high productivity and reliability applicable to flip chip mounting of next generation LSI contains the convection additive 12 which boils when resin 13 is heated. When the resin 13 is heated, the metal particles melt in the resin, and the boiling convection additive 12 convex in the resin.n n n The metal particles melted in the resin 13 by heating the resin 13 supplied between the circuit board 10 and the semiconductor chip 20 form the terminals of the circuit board 10 and the semiconductor chip 20 ( By self-assembly between 11 and 21, the connection body 22 which electrically connects between terminals is formed, after that, resin 13 is hardened and the semiconductor chip 20 is fixed to the circuit board 10. FIG. By doing so, a flip chip mounting body is obtained. |