http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101233642-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3dba97693782916b637c6f28ea84b4a5 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4697 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
| filingDate | 2011-11-28^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-02-15^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b9151423553ea42677f7816d56228a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1327c5092eca28a3199a5d33bd91a90b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d71df50ad5d2beaa371df847e9c5f56 |
| publicationDate | 2013-02-15^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101233642-B1 |
| titleOfInvention | Cavity Printed Circuit Board Manufacturing Method |
| abstract | According to the present invention, holes in the cavity area of the copper clad laminate are first formed by a mechanical drill method, and then filled into holes using an epoxy ink or the like to perform hole plugging, and then the epoxy ink is cured by heat. Epoxy inks here are glass fibrous or filler free insulating materials. Then, copper plating is performed and copper foil is formed on both upper and lower sides. Next, an insulating layer such as prepreg and copper foil are laminated and laminated. At this time, the insulating layer corresponding to the portion to form the cavity may be cut and laminated after cutting. In this case, the resin melts from the surrounding prepreg insulating layer during the hot press lamination process, and the space where the caviar is formed is filled with only an epoxy resin without glass fiber. Finally, when laser drilling is performed on the hole plugged epoxy and the hardened epoxy layer, unlike the prior art, there is no glass fiber or filler that interferes with the laser drill process, thereby forming a cavity of a precise size very easily. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101726568-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101666476-B1 |
| priorityDate | 2011-11-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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