http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101281429-B1

Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-082
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-09
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filingDate 2010-07-29^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-07-02^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2013-07-02^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101281429-B1
titleOfInvention Method of manufacturing piezoelectric element
abstract By plasma etching, the manufacturing method of the piezoelectric element which processes a ferroelectric film to a favorable shape is provided. The metal mask which consists of a metal thin film which is hard to be etched with oxygen gas is arrange | positioned on the process object by which the lower electrode layer and the ferroelectric film were laminated | stacked on this board | substrate in this order. The etching gas containing the oxygen gas and the mixed gas of the reaction gas containing fluorine in the chemical structure is plasma-formed, the metal mask is brought into contact with the object to be treated, and an alternating voltage is applied to the electrode under the object to treat ions in the plasma. Is injected to anisotropically etch the ferroelectric film. Etching for a long time is possible, and no etching product adheres to the etched side surface, whereby a piezoelectric element having a ferroelectric film of good shape is obtained.
priorityDate 2009-08-06^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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