http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101335158-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-3407 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C49-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F7-062 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C47-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C49-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34 |
| filingDate | 2006-12-27^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-12-02^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-12-02^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101335158-B1 |
| titleOfInvention | Sputtering Target Structure |
| abstract | (Problem) Provides a sputtering target structure which is excellent in machinability and thermal conductivity, has good wettability to solder material, is inexpensive, can be used repeatedly for a long time, and does not cause a problem of cracking or peeling of the sputtering target. .n n n (Solving means) A sputtering target structure formed by joining a sputtering target and a backing plate, wherein the backing plate is made of a material having a difference in linear expansion coefficient between the sputtering target material and 2 × 10 -6 / K or less, and at least one side of the backing plate Sputtering target structure by which the copper plate of thickness 0.3-1.5 mm is arrange | positioned at the edge.n n n n Sputtering Target Structure |
| priorityDate | 2005-12-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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