| abstract |
(Objective) A method of manufacturing a wiring board having built-in parts is provided. The method achieves a reliable connection between the part and the interlayer insulating layer, so that the wiring board with built-in parts has excellent reliability.n n n The wiring board is manufactured through a core board preparation step, a component preparation step, a receiving step and a height alignment step. In the core board preparing step, a core board 11 having a receiving hole 90 therein is prepared. In the component preparation step, a ceramic capacitor 101 having therein a plurality of protruding conductors 51 protruding from the capacitor rear surface 103 is prepared. In the receiving step, the ceramic capacitor 101 is received in the receiving hole 90 with the core rear surface 13 facing the same side as the capacitor rear surface 103. In the height aligning step, one surface of the upper portion 52 of the protruding conductor 51 and one surface of the conductor layer 62 formed on the core rear surface 13 are aligned at the same height. |