| titleOfInvention |
Member for a semiconductor device, member forming liquid for a semiconductor device and a method for manufacturing a member for a semiconductor device, and a liquid for forming a member for a semiconductor device, a phosphor composition, a semiconductor light emitting device, a lighting device, and an image display device |
| abstract |
Disclosed is a member for a semiconductor device which is excellent in heat resistance, light resistance, film forming property, and adhesion, and can hold a phosphor by encapsulating a semiconductor device without causing cracking, peeling, or coloring even when used for a long period of time. Therefore, the heating weight measured according to the predetermined heating weight measurement method is set to 50% by weight or less for the semiconductor device member, and the peeling ratio measured according to the predetermined adhesion evaluation method is set to 30% or less.n n n n Image display device, illumination device, semiconductor device, member for semiconductor device, phosphor, heat resistance, light resistance, film formability, adhesion |