http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101593909-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-182 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-623 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2009-03-10^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-02-15^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-02-15^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101593909-B1 |
| titleOfInvention | Epoxy resin compositions having improved low temperature cure properties and processes and intermediates for making the same |
| abstract | The present invention relates to a two-component epoxy resin composition. The polyepoxide component comprises at least one oligomer having at least one aromatic ring substituent R 4 X 1 -, wherein each R 4 is independently selected from the group consisting of a substituted or unsubstituted aliphatic group having 4 or more carbon atoms, a substituted or unsubstituted alicyclic group having 5 or more carbon atoms (Oxyalkylene) group having an average carbon number of at least 3 per oxyalkylene unit, or a substituted aryl group having at least one substituent, wherein the substituent is directly bonded to the aryl group via a covalent bond, Or carbonyloxy 2 is bonded to the aryl group through a linking group, or a combination thereof; X 1 is a covalent bond or a divalent moiety selected from oxy, thio, carbonyloxy and -X 2 C (R 2 ) 2 C (R 1 ) (OH) C (R 2 ) 2 O-; X 2 is a covalent bond or a divalent residue selected from oxy, thio and carbonyloxy; R 1 is -H or -C 1-14 alkyl; R includes each independently H or -CH 3]. The curing agent component comprises at least one compound of formula (VI) and / or at least one adduct of at least one compound of formula (VI). The two-component epoxy resin composition can be rapidly cured even at a low ambient temperature, for example, less than 10 ° C, for example, less than 5 ° C or less than 0 ° C to rapidly form a non-adhesive film and seal having excellent appearance . VI (R 5 ) Ph (OH) j [CHR 6 NH (ZNH) m H] k In the above formula (VI) Z is independently a divalent hydrocarbylene group having 2 to 20 carbon atoms, R 5 is a C 8-20 saturated or unsaturated aliphatic ring substituent, R 6 is independently a hydrogen atom or a hydrocarbyl group having 1 to 10 carbon atoms, optionally having at least one heteroatom, m is independently an integer ranging from 1 to 4, k is an integer ranging from 1 to 3, j is 1 or 2; |
| priorityDate | 2008-04-07^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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