| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0853
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03B33-0222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-38 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K103-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-0622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03B33-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-08 |
| filingDate |
2010-01-27^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-07-13^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-07-13^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101757937-B1 |
| titleOfInvention |
Workpiece cutting method |
| abstract |
A crack 17a is caused to occur on the surface 12a of the object 1 from the modified region 7a while the unmodified region 2 is interposed between the modified region 7b and the back surface of the object 1 Thereby causing cracks 17b in the first and second portions 12b. As a result, cracks can be prevented from continuously proceeding in the thickness direction of the silicon substrate 12 when the modified region 7 is formed in a plurality of rows. Then, by causing the object 1 to be stressed, the object 1 is subsequently cut by the crack 17a and the crack 17b in the unmodified region 2. This makes it possible to prevent meandering of cracks on the back surface 12b of the object 1 and to cut the object 1 accurately along the line along which the object is intended to be cut 5. [ |
| priorityDate |
2009-02-09^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |