Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32257 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1715 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 |
filingDate |
2011-05-25^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2018-03-29^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2018-03-29^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-101843402-B1 |
titleOfInvention |
Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component |
abstract |
The present invention relates to a surface mountable optoelectronic device (1) having a radiation passing surface (10), an optoelectronic semiconductor chip (2) and a chip carrier (3). A cavity 31 is formed in the chip carrier 3, and the semiconductor chip 2 is disposed in the cavity. A molding body 5 at least locally surrounds the chip carrier 3 in which case the chip carrier 3 is provided with the molding body 5 in a vertical direction running perpendicular to the radiation- Extend completely through. The present invention also relates to a method for manufacturing a surface mountable optoelectronic device. |
priorityDate |
2010-06-15^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |