| abstract |
The anisotropic conductive film which uses metal particles, such as solder particle which has an oxide film on the surface, as an electroconductive particle for anisotropic conductive connection is equipped with a metal particle in an insulating film, and is arrange | positioned regularly when a metal particle is planarly viewed. At least one of the ends of the anisotropic conductive film surface side or the anisotropic conductive film rear surface side of the metal particles is disposed so that the flux contacts or comes close to each other. Preferred metal particles are solder particles. It is preferable that the insulating film has a two-layer structure, and metal particles are disposed between the layers. |