http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102071599-B1

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publicationDate 2020-01-30^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102071599-B1
titleOfInvention High selectivity Silicon Nitride Etchant composition
abstract The present invention relates to an etching composition for a silicon nitride film, which is used to etch away a silicon nitride film in a semiconductor process, and wherein the etching rate of the silicon nitride film is higher than that of a silicon oxide film in a high temperature etching process. It relates to a composition for high selectivity etching. According to the present invention, the high selectivity etching composition is a silicon nitride film and the silicon oxide film of the silicon oxide film is selectively etched at a high selectivity at the same time to minimize the damage and etching rate on the silicon oxide film and insoluble silicon compound by silicon nitride film etching Minimize creation
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111925803-A
priorityDate 2018-02-09^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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