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filingDate 2016-02-11^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-03-03^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-03-03^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102083819-B1
titleOfInvention Dishing reducing in tungsten chemical mechanical polishing
abstract The present invention relates to slurries, methods and systems that can be used in chemical mechanical polishing (CMP) of tungsten-containing semiconductor devices. Additives are used to reduce dishing on large feature sizes and small feature sizes (large bond pads as well as fine line structures) without delaying tungsten removal rates.
priorityDate 2015-02-12^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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