http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102088840-B1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-04
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-00
filingDate 2013-09-10^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-04-16^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-04-16^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-102088840-B1
titleOfInvention ETCHANT COMPOSITION FOR NICKEL-BASED METAL LAYER AND TiN
abstract The present invention, based on the total weight of the composition, a) 5 to 60% by weight of one or more components selected from the group consisting of nitric acid and sulfonic acids, b) 0.1 to 40% by weight of hydrogen peroxide, and c) containing the remaining amount of water Provided is a composition for etching a nickel-based metal film and TiN.
priorityDate 2013-09-10^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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