| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-3323 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-45544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-45542
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-45551
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-45525
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4584
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02164
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68764
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32779
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67248 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-687
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate |
2016-06-14^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-03-27^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-03-27^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102094576-B1 |
| titleOfInvention |
Substrate processing method and substrate processing apparatus |
| abstract |
An object of the present invention is to uniformly perform processing at both ends and centers of a wafer in a radial direction that connects the center of rotation and the center of the wafer of the rotation table when a plurality of substrates on the rotation table are processed simultaneously, such as a film forming process. . Processing by loading a plurality of wafers (W 1 ~W 5) arranged on the rotary table 14, and the axis (P) in the vessel while rotating the rotary table 14 to the wafer (W 1 ~W 5) Film-forming processing is performed. In the gap between the wafers W 1 to W 5 arranged on the rotary table 14, dummy objects OD and ID are arranged. |
| priorityDate |
2015-06-15^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |