| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67017 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4586
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B43-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68707
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-45544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B41-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28506
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67276
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67742
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02164
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0217
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68742
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67248 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-677
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate |
2019-02-26^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-01-22^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-01-22^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102206183-B1 |
| titleOfInvention |
Method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus |
| abstract |
There is a problem in that the processing quality of the substrate is deteriorated by the device structure formed on the substrate. In the present disclosure, there is provided a process comprising: receiving substrate data including the number of layers of a device formed on a substrate or the number and structure of the layers of the device; Setting a device parameter corresponding to the substrate data; A step of supporting a substrate corresponding to the substrate data by being spaced apart from the substrate mounting table by a holding height determined by the device parameter above the substrate mounting table; A first temperature raising step of heating the substrate based on the device parameter while being separated from the surface of the substrate mounting table; A step of placing the substrate on the substrate mounting table after the first heating step; And a process of processing the substrate in a processing chamber. |
| priorityDate |
2018-03-26^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |