| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A44B19-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-625 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10 |
| filingDate |
2018-04-03^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-04-22^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-04-22^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102243188-B1 |
| titleOfInvention |
Plating material and its manufacturing method |
| abstract |
Due to the interface between the plated layer and the substrate, there is a problem that the adhesion between the plated layer and the substrate is low. The plating material 5 includes a substrate 51 including one or more substrate metal elements, and a plating layer 52 formed directly on the substrate 51. The plating layer 52 contains at least a first plating layer metal element and a second plating layer metal element different from the first plating layer metal element. The second plating layer metal element is the same metal element as at least one of the one or more base metal elements. As the plating layer 52 is spaced apart from the substrate 51 in the thickness direction of the plating layer 52, the proportion of the metal elements of the second plating layer in the plating layer 52 continuously decreases. Crystal grains of an alloy containing at least the first and second plating layer metal elements are distributed in the plating layer 52 so that a clear interface does not occur between the substrate 51 and the plating layer 52. |
| priorityDate |
2017-04-14^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |