| abstract |
It is excellent in storage stability and provides the photosensitive resin composition with high sensitivity, the cured film using the photosensitive resin composition, a laminated body, the manufacturing method of a cured film, and a semiconductor device. Moreover, the novel compound used in order to form the photosensitive resin composition is provided. A photosensitive resin composition comprising a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor, a radically polymerizable compound having a sulfur atom, a photoradical polymerization initiator, and a solvent. |