http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102380981-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6715 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B7-0014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02307 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67051 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05B1-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68764 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76826 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05B1-30 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05B1-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate | 2018-11-06^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-04-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-04-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102380981-B1 |
| titleOfInvention | Substrate processing apparatus, method of manufacturing semiconductor device, and storage medium |
| abstract | The present invention provides a substrate processing apparatus and the like that can be removed relatively easily and can form a polymer film having urea bonds. In the substrate processing apparatus 8, a substrate W for manufacturing a semiconductor device is loaded on the mounting table 81, and the first liquid supply unit 87B supplies a first raw material solution containing isocyanate and a solvent. and the second liquid supply unit 87A supplies the second raw material solution containing the amine and the solvent. From the nozzle part 86 provided at the distal end of the liquid flow path 861 where the first raw material solution and the second raw material solution merge to obtain the mixed solution, the mixed solution is supplied to form a polymer film having urea bonding on the surface of the substrate W. supply This polymer film is temporarily used in the manufacturing process of a semiconductor device and then removed by depolymerization. |
| priorityDate | 2017-11-07^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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