| abstract |
In the manufacturing method of the wafer mounting table of this embodiment, (a) a ceramic slurry containing ceramic powder and a gelling agent is filled in the mesh portion 22a of the metal mesh 22, and the gelling agent is chemically reacted to gel the ceramic slurry. Then, a step of manufacturing the ceramic filled mesh 20 by degreasing and calcining, and (b) a ceramic filling between the first ceramic calcined body 31 and the second ceramic calcined body 32 obtained by performing mold casting and calcination A process of producing the laminated body 40 by sandwiching the mesh 20, and (c) a process of manufacturing the wafer mounting table 10 by hot press firing the laminated body 40 are included. |