| abstract |
A semiconductor device in which a first semiconductor element is wire-bonded connected via a first wire on a substrate and a second semiconductor element is pressed onto the first semiconductor element, wherein the second semiconductor element is compressed, and at least the first wire is pressed. A film adhesive used to embed at least a part of a film adhesive, comprising a first adhesive film and a second adhesive film laminated on the first adhesive film, wherein the solvent content of the film adhesive is based on the total amount of the film adhesive It is 1.5 mass % or less, and the shear viscosity in 80 degreeC of a film adhesive is 5000 Pa.s or less, The film adhesive is disclosed. |