| abstract |
A method of manufacturing a monolithic ceramic electronic component includes providing a ceramic slurry, a conductive paste, and a ceramic paste; A ceramic green sheet manufactured by forming the ceramic slurry, an internal circuit element film formed to partially apply the conductive paste on the main surface of the ceramic green sheet to provide a step according to the thickness of the ceramic green sheet, and the A ceramic green layer formed by applying the ceramic paste to an area on a major surface of the ceramic green sheet on which the internal circuit element film is not formed to substantially compensate for the space specified by the step, wherein the space specified by the step Forming a plurality of composite structures each comprising a ceramic green layer to compensate for the loss; Forming a green laminate by stacking the composite structure; And calcining the green laminate, wherein the ceramic paste includes a ceramic powder, an organic solvent, and an organic binder. Also described are monolithic ceramic electronic components, ceramic pastes, and methods of making the ceramic pastes produced through the process. |