http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20020062065-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b1007735376d07808ebe297f823b2829
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32724
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
filingDate 2001-01-19^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43067f4f4acb6082835dc58363e29e04
publicationDate 2002-07-25^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20020062065-A
titleOfInvention an apparatus for dry etching
abstract The present invention relates to a dry etching apparatus, in which a general dry apparatus is provided with a cooling line under the lower electrode, thereby preventing the temperature of the lower electrode from rising by the plasma. However, temperature difference occurs where the cooling line is located and where it is not, and the temperature can not be rapidly reduced by using the liquid coolant, resulting in staining during etching of the thin film.n n n In the present invention, the cooling unit is formed inside the lower electrode, so that the cooling unit corresponds to the entire surface of the lower electrode, and the temperature of the lower electrode can be made uniform by using a coolant made of gas. As a result, the temperature of the reactant to be etched on the lower electrode is also uniform, thereby preventing staining and improving productivity.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100684360-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100716456-B1
priorityDate 2001-01-19^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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