| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F01P2060-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F01M2005-004 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F01M5-002 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68 |
| filingDate |
2001-06-27^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_862993e3907bfb5742a2fe2d51e89cd3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0dd9f40a9e688aa77546d92a6588d8c4 |
| publicationDate |
2003-01-06^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20030000768-A |
| titleOfInvention |
electro static chuck with shadow ring |
| abstract |
An improved technique is disclosed for effectively controlling defects occurring in the inclined portion of a wafer by attaching a shadow ring to an electrostatic chuck in an etching process during wafer processing. An apparatus for adsorptively supporting a semiconductor wafer, the apparatus comprising: an electrostatic chuck for adsorbing a rear surface of the semiconductor wafer by electrostatic force; And a shadow ring installed at the electrostatic chuck and covering the inclined surface of the upper edge of the semiconductor wafer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100702541-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013077570-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100815539-B1 |
| priorityDate |
2001-06-27^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |