| abstract |
The present invention provides an inductor using a plurality of metal layers, comprising: a first metal wire formed on a first insulating layer on a semiconductor substrate and connected to the outside; and a spiral formed on a second insulating layer on the first insulating layer. A plurality of metal wires sequentially stacked on the second metal wires having the same shape as that of the second metal wires and connected to the via holes; The width of the second metal wires is smaller than the width of the plurality of metal wires. This results in less series resistance losses in the frequency band, less loss to the substrate, and lower noise figure or unwanted signals due to high fidelity in use in low noise amplifiers, voltage controlled oscillators, matching circuits, and band pass circuits. By attenuating, non-integrated components can be integrated like other circuits, resulting in high performance and low cost. |