http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030065605-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1725b6e8275d0e977913e54649a480f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1bcfa59f8aa4f2b11977e5ce705143bd
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-562
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-12
filingDate 2002-01-30^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78d0e19980b4ebf81dfb3afddbf535f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_261002ec50270aed053a6baeb0a59d4e
publicationDate 2003-08-09^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20030065605-A
titleOfInvention electroplating bath for copper-nickel alloy and method for manufacturing thin film using said electroplating bath
abstract The copper-nickel alloy thin film plating solution and a thin film manufacturing method using the solution include DTPA as a mixed solution of copper salt (CuSO 4 H 2 O) and nickel salt (NiSO 4 6H 2 0) and a complexing agent, and the copper salt is 24.7 ~ 49.9 g / L, nickel salts range from 209.6 to 235.8 g / L, and the amount of DTPA added is in the range of 39.3 to 78.6 g / L. In addition, the copper-nickel alloy plating solution further includes sodium heptonate as an additive for the uniformity of the surface layer, sodium sacalin to improve the smoothness and gloss of the plating surface.n n n As another embodiment of the present invention, the current density is 30 ~ 50 A / cm 2 , pH value of 6.0 ± 0.5 using the copper-nickel alloy plating solution to have a nickel composition of 60 to 80% by weight Provided is a method for manufacturing a copper-nickel alloy thin film formed at.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104321470-B
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priorityDate 2002-01-30^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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