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publicationDate 2005-04-08^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20050033072-A
titleOfInvention Laser machining
abstract The silicon substrate W is processed by a UV or green laser beam 6 in a cooled liquid halogenated environment. Local heating of the liquid halogenated compound by the laser beam in the vicinity of the processing position causes a chemical reaction between the silicon substrate and the liquid halogenated compound to promote the processing, improve the processing quality and reduce the generation of debris by laser processing.
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