| abstract |
Disclosed are a photosensitive polymer resin having a high resolution and capable of forming a fine circuit pattern even under a short wavelength exposure source and a chemically amplified photoresist composition comprising the same. The photosensitive polymer resin is represented by the following formula (1).n n n [Formula 1]n n n n n n n n Wherein R 1 is hydrogen, R 2 is hydrogen, , or R 3 is chloro, bromo, hydroxy, cyano, t-butoxy, CH 2 NH 2 , CONH 2 , CH = NH, CH (OH) NH 2 or C (OH) = NH, R 4 Is hydrogen or a methyl group, and 1-xy, x, y are degrees of polymerization of each repeating unit constituting the photosensitive compound, x and y are each 0.1 to 0.8, and n is 1 or 2. |