http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20060098461-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_154f5a8a983d88f296117dcc92946ab4 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A47G29-087 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A47G25-0607 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J17-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J11-46 |
| filingDate | 2005-03-03^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f77b603eb91ed95886451a650f7b9a2d |
| publicationDate | 2006-09-19^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20060098461-A |
| titleOfInvention | Integrated circuit chip heat dissipation structure of plasma display module and plasma display module having same |
| abstract | The present invention provides an integrated circuit chip heat dissipation structure of a plasma display module capable of effectively dissipating heat generated from an integrated circuit chip by mounting a heat dissipation plate having a folding shape on a cover plate, and a plasma display module having the same. In order to achieve the above object, the present invention provides a chassis comprising a chassis bent portion and a chassis base, an integrated circuit chip mounted in contact with the chassis bent portion and connected to a signal transmission means, and the integrated circuit. An integrated circuit chip heat dissipation structure of a plasma display module including a cover plate installed on the chassis bent portion facing the chip, and a heat dissipation plate mounted on the cover plate and having a folding shape, and a plasma display module having the same do.n n n In addition, to achieve the above object, the present invention provides a chassis comprising a reinforcement and a chassis base, an integrated circuit chip mounted in contact with the reinforcement and connected to the signal transmission means, and facing the integrated circuit chip. An integrated circuit chip heat dissipation structure of a plasma display module including a cover plate installed on a reinforcement member and a heat dissipation plate mounted on the cover plate and having a folding shape, and a plasma display module having the same. |
| priorityDate | 2005-03-03^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 |
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