| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2002-14419
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-8554
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-435
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2002-14241
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-2047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-853
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1632
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-14233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-161
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1629
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1646 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-491
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-135
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-43
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-39
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01G25-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01G23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-638 |
| filingDate |
2006-03-30^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f44a11946c40c0d75041932d39ac51d8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cbc831b81ddc6df9c547048090298f1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0063a2f45922925905a1b3e5a6d6e178
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_33c3698e5c7d5c7ceae1ee4b143a690f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5b8415815dfeac648489256a37e0054 |
| publicationDate |
2006-10-11^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20060105538-A |
| titleOfInvention |
Method for manufacturing dielectric film, method for manufacturing piezoelectric element and method for manufacturing liquid jet head, dielectric film, piezoelectric element, and liquid jet device |
| abstract |
Provided are a method of manufacturing a dielectric film that can control crystal states relatively easily and always obtain stable characteristics, and a method of manufacturing a piezoelectric element capable of improving the characteristics of a piezoelectric element.n n n A coating step of forming a dielectric precursor film by applying a colloidal solution containing an organometallic compound containing at least a metal constituting the dielectric film including lead components, a drying step of drying the dielectric precursor film, and degreasing to degrease the dielectric precursor film. And a firing step of baking the dielectric precursor film to form a dielectric film, wherein the drying step is a first drying in which the dielectric precursor film is dried by heating at a temperature lower than a boiling point of a solvent that is a main solvent of the material and maintaining it for a predetermined time. And a second drying step of drying the dielectric precursor film in a range of 140 ° C. to 170 ° C., wherein the degreasing step results in a temperature of degreasing at 350 ° C. to 450 ° C. and a temperature increase rate of 15 [° C./sec] or more. In the firing step, the temperature increase rate is 100 [° C / sec] to 150 [° C / sec]. |
| priorityDate |
2005-03-31^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |