| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a16f72268f5a1eb4f08073323a474668 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85464
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48664
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate |
2005-04-26^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2f95afac8a8883f3e6183ddb03e8163
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dd906ff82da04a3c0d7868085611552 |
| publicationDate |
2006-10-31^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20060112119-A |
| titleOfInvention |
Lead frame for semiconductor package and manufacturing method thereof |
| abstract |
An object of the present invention is to provide a lead frame for a semiconductor package having a structure in which the galvanic potential difference between the respective plating layers is lowered and a method of manufacturing the lead frame. A base metal layer made of metal; Ni plated layer formed by plating on the base metal layer and made of nickel or nickel alloy; A Ni-Pd plating layer formed by plating on the Ni plating layer and made of a nickel-palladium alloy; Provided is a lead frame for a semiconductor package having a protective plating layer formed on the Ni-Pd plating layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150049644-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130066502-A |
| priorityDate |
2005-04-26^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |