http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20070031809-A
Outgoing Links
Predicate | Object |
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classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B38-162 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 |
filingDate | 2006-09-14^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2007-03-20^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-20070031809-A |
titleOfInvention | Method of manufacturing copper clad laminate |
abstract | The manufacturing method of the copper clad laminated board which improved the adhesive force of copper foil and polyimide resin is provided. A method for producing a copper clad laminate obtained by forming a resin layer on a surface-treated copper foil, the method of soft etching the copper foil with an acid solution, and at least one of an amino group and a thiol group having a function of improving the adhesion between the copper foil and the resin layer. A surface treatment step of surface treatment with a treatment solution in which an organic surface treatment agent having more than one functional group is dissolved, a washing step of partially dissolving and removing the surface layer of the organic surface treatment agent using an organic solvent that can dissolve the organic surface treatment agent, and a surface treatment. The manufacturing method of the copper clad laminated board which has the adhesion lamination process which adhere | attaches the film of a polyimide precursor on the obtained copper foil, and the imidation process which imides a polyimide precursor.n n n Copper foil, polyamide, surface treatment, copper clad laminate, adhesion |
priorityDate | 2005-09-15^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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