http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080011091-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1fad0246171945d5e4957c9be0b37a2f |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1266 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66765 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 2007-07-26^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55b1e3b8e9900f3c2c689e49cb17ad4d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1fa39d90fb8180723b70844f2ed0589a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76e271adbd2ddbae640e8e86a7dd647c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebd3b37db0025744f06d480afaec5784 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5f9f62397f74787903973d9c0e8337e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39aaae30c1707811aa107f59d5428ad |
| publicationDate | 2008-01-31^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20080011091-A |
| titleOfInvention | Manufacturing Method of Semiconductor Device |
| abstract | Provided is a method of manufacturing a semiconductor device which can reduce costs with a small number of processes. Moreover, the manufacturing method of the semiconductor device which has a semiconductor element which has a semiconductor layer of a desired shape even if a resist is not used is provided. In addition, the present invention provides a method of manufacturing a semiconductor device capable of increasing the efficiency at the time of correcting a defect in a wiring formed on a substrate and increasing the yield and mass productivity.n n n Forming a light absorbing layer on one side of the first substrate, providing a second substrate on the light absorbing layer, providing a mask so as to face the other surface of the first substrate, A method of manufacturing a semiconductor device comprising the step of transferring a portion of a layer that absorbs light to a second substrate by irradiating a laser beam through a mask. |
| priorityDate | 2006-07-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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