http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080020946-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B49-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate | 2007-08-27^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80acf29d41c626f58bbf03ec09fe213a |
| publicationDate | 2008-03-06^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20080020946-A |
| titleOfInvention | Metal polishing method |
| abstract | A metal polishing method for supplying a metal polishing liquid to a polishing pad on a polishing plate and rotating the polishing plate to make the polishing pad in relative movement while being in contact with the surface to be polished of the polished object. Containing a polishing particle having a ratio of 1.2 to 5.0 and a short diameter, an organic acid containing a secondary nitrogen atom or a tertiary nitrogen atom, and a heterocyclic compound, wherein the contact pressure between the polishing surface and the polishing pad is 4000 to 12000 Pa, The present invention also provides a metal polishing method with low dishing at a high polishing rate at which the surface of the polishing pad that the surface to be polished is in contact with or the temperature of the surface to be polished is 35 ° C or more and less than 75 ° C. |
| priorityDate | 2006-09-01^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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